Summary
Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.
We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.
Description
This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance, Developing detailed and reduced-order thermal models, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.
